[제조/PM] Sr. Product Manager

A global manufacturing company is looking for a Sr. Product Manager. The selected applicant will drive growth of the product portfolio within wafer back-end and advanced packaging through market insights, strategic initiatives, and business development.

Responsibilities:

• Manage the product portfolio based on expertise, customer insights, and market trends
• Build and expand business and portfolio within wafer back-end and advanced packaging
• Support strategic sales initiatives by identifying key customers and long-term growth opportunities
• Drive the division’s strategy process, including planning, coordination, analysis, and long-term development
• Take ownership of business cases supporting new initiatives and investments
• Support integration within the responsibility area
• Own and develop the product portfolio, ensuring competitiveness and growth
• Drive segment strategy, including market analysis, long-term planning, and coordination of initiatives
• Build and validate business cases for new products, investments, and growth initiatives
• Translate technology into customer and financial value, connecting technical capabilities to commercial outcomes
• Lead through influence across functions and regions, collaborating with headquarters and global stakeholders

Requirements:

• Bachelor’s degree or above in Engineering (Physics, Electrical Engineering, Materials Science, Microelectronics, Semiconductor Engineering)
• 5-10 years of similar business or position, good knowledge of:
• Wafer back-end and advanced packaging markets and applications
• Semiconductor manufacturing flows, including yield, process control and quality requirements for the back-end and packaging processes
• Customer needs within the industry segment
• Proven experience in owning and managing a product portfolio, including defining roadmaps and handle life cycle management
• Established network within the semiconductor ecosystem (customers, suppliers, etc.)

Preferred Requirements:

• MBA or equivalent business education
• Experience working with Asian markets
• Experience in wafer bump process
• Experience from the USA and Europe

About the Company:

A global high-tech company that designs and supplies advanced manufacturing equipment for the electronics industry. Its solutions are used in applications such as printed circuit board assembly, semiconductor packaging, and display production.

Keywords:

엔지니어링, 제품 관리, 전자, 반도체, 제조, 글로벌

Job Ref: IFQOLY